Inolas Solutions Flexible Substrate Laser Processing Equipment
Inolas Solutions' laser processing equipment cuts rigid substrates, flexible substrates, and composite substrates quickly and cleanly.
Inolas Solutions' laser processing equipment cuts rigid substrates, flexible substrates, and composite substrates quickly and cleanly. It is also an optimal solution for drilling holes in substrates, contour processing, and splitting component mounting substrates. **Benefits of Laser Processing Equipment for PCB and Flexible Substrates:** - Compared to NC processing, the precision and cleanliness of the cutting surface are very high. - It does not impose thermal or vibrational stress on the substrates. - It allows for depaneling with a small laser spot diameter, enabling more substrate layouts on a single panel. - It can accurately and quickly split substrates with curved shapes. - The manufacturer's unique laser technology helps reduce the burden of capital investment in laser processing equipment.
- Company：DKSHマーケットエクスパンションサービスジャパン テクノロジー事業部門
- Price：Other
