We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Circuit board laser processing machine.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Circuit board laser processing machine - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Circuit board laser processing machine Product List

1～5 item / All 5 items

Displayed results
Laser processing machine for film and resin substrates <Sample processing currently accepting>

Laser processing machine for film and resin substrates <Sample processing currently accepting>

Achieving high-precision processing with femtosecond and high-output nanosecond lasers. Improving yield in semiconductor and GPU manufacturing.

We offer laser processing machines for films and resin substrates equipped with laser oscillators that cover a wide range of pulse widths and wavelengths, from nanoseconds to picoseconds and femtoseconds. Our unique trepanning head allows for high aspect ratio drilling at 1:50, and we can accommodate various substrate and film processing needs, including cutting, marking, and thin film removal. Based on the results of sample processing, we will provide proposals considering your budget and target takt time. 【Features】 ■ Improves productivity and yield with precision and high-speed cutting for FPCs and PCBs used in semiconductor mounting. ■ Capable of supporting dual head configurations and automatic transport and discharge functions. ■ Rapid maintenance and support system unique to our Japanese corporation. *For more details, please view the materials by clicking the "Download Catalog" button. For sample processing inquiries, feel free to contact us through the "Contact Us" section.

  • Other processing machines
  • Circuit board laser processing machine

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-precision laser drilling device (UV) with a minimum beer diameter of 5μm or more.

High-precision laser drilling device (UV) with a minimum beer diameter of 5μm or more.

Next-gen drilling for ABF and BT substrates. Achieve 5μm vias with ±5μm precision. Ideal for high-density AI chip packaging.

The micromachining by Photonics Systems Group (PSG) is a cutting-edge laser drilling solution designed for the next generation of high-density interconnects (HDI) and advanced semiconductor packaging. As AI and high-performance computing (HPC) drive the need for extreme miniaturization, this system delivers the capability to drill ultra-fine microvias as small as 5μm in diameter. Optimized for advanced dielectric materials such as ABF (Ajinomoto Build-up Film), BT resins, and specialized glass substrates, it ensures clean, high-aspect-ratio holes with zero debris and minimal thermal impact. Equipped with a high-resolution vision system and ultra-fast galvanometer scanners, the system maintains a positioning accuracy of ±5μm. This level of precision is essential for the reliable fabrication of multi-layer substrates used in advanced IC packaging, where alignment between layers is critical for yield and performance.

  • Circuit board processing machine
  • Circuit board laser processing machine

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Laser processing machine for DCB/AMB substrates | Minimum hole diameter 30μm, accuracy 5μm

Laser processing machine for DCB/AMB substrates | Minimum hole diameter 30μm, accuracy 5μm

Achieves a minimum hole diameter of 30μm and a machining accuracy of ±5μm. Suppresses thermal effects on DCB and AMB substrates with a picosecond laser. For cutting, drilling, and pattern formation.

【The Definitive Solution for Heat Dissipation Substrate Processing for Next-Generation Power Semiconductors】 The CR20x0 series is the latest laser system from German company PSG, specialized in the precision processing of DCB (Direct Copper Bonding) and AMB (Active Metal Brazing) substrates, which are essential for power electronics. ■ Pico-Second Laser Processing Pursuing "Zero Thermal Damage" By employing ultra-short pulse lasers, thermal effects on ceramic and copper composite materials are minimized to the extreme. It prevents "cracks," "burrs," and "delamination" that could not be avoided with physical cutting tools or long-pulse lasers, ensuring a high-quality finish. ■ Overwhelming Processing Specifications Minimum Hole Diameter 30μm: Capable of processing extremely small vias with high circularity. Processing Accuracy ±5μm: Maintains extremely high positional accuracy over a wide range due to all-axis linear motor drive and high-resolution glass scales. Compatible with a Variety of Materials: Proven high performance with various ceramic materials such as Al2O3, AlN, and Si3N4.

  • Circuit board processing machine
  • Circuit board laser processing machine

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Related Categories of Circuit board laser processing machine

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.